HOMESITEMAPkorean
인사말
인사말연혁사훈 및 경영이념조직도찾아오시는 길해외협력업체
FPD사업부
OPG-100 B6 PGG5 PGMQX-1500MQX-2500UPGAging Chamber Inline AgingeDP BoardMIPI Board
Power Module/LED조명 사업부
CNPMLED조명
소재사업부
PCB/CCL용 동박 Li-ion Battery용 동박 ENTRY SHEET  BACKUP BOARD  ENTRY SHEET, BACKUP BOARD 제조사
가시광통신
매뉴얼 & 카탈로그인증 및 특허
공지사항
견적문의A/S문의sitemap
Item Specification
18 μm 35 μm 70 μm
elongation (%) Room Temperature > 2.0 > 3.0 > 3.0
Weight per
square meter (g/㎡)
153 ± 5 285 ± 5 585 ± 8
Tensile Strength (Kgf/m㎡) Room Temperature > 30.0 > 35.0 > 35.0
Roughness Ra (μm) 0.2 ~ 0.43 0.2 ~ 0.43 0.2 ~ 0.43
Rz (μm) < 8.0 < 10.0 < 13.0
Copper Chip None None None
Furnace Test(200°C , 40min) No Color Change No Color Change No Color Change
Item Specification
12 μm 15 μm 18 μm 28 μm 35 μm 70 μm
Elongation (%) RT > 3.0 > 3.0 > 5.0 > 6.0 > 10.0 > 10.0
180°C > 3.0 > 3.0 > 3.0 > 3.0 > 5.0 > 5.0
Weight per square
meter(g/㎡)
107 ± 3 125 ± 3 153 ± 5 235 ± 5 285 ± 5 585 ± 8
Tensile Strength (Kgf/m㎡) 상온 30.0~40.0 30.0~40.0 30.0~40.0 30.0~40.0 30.0~40.0 30.0~40.0
180°C 18.0~25.0 18.0~25.0 18.0~25.0 18.0~25.0 18.0~25.0 18.0~25.0
Roughness Ra
(μm)
0.2 ~ 0.38 0.2 ~ 0.38 0.2 ~ 0.38 0.2 ~ 0.38 0.2 ~ 0.38 0.2 ~ 0.38
Rz
(μm)
< 6.5 < 7.0 < 8.0 < 9.0 < 10.0 < 12.0
Copper Chip None None None None None None
Furnace Test
(200°C , 40min)
No Color Change No Color Change No Color Change No Color Change No Color Change No Color Change